Description
The SMB Female Solder Type Connector is a subminiature RF interface designed for engineers and technicians who prioritize the electrical superiorities of a soldered connection. Unlike crimp-only variants, this solder-type connector allows the center conductor of LMR-100, RG-174, and RG-316 cables to be fused directly to the internal pin, ensuring maximum conductivity and the lowest possible contact resistance.
The connector features a snap-on mating mechanism, providing a fast and secure connection that is ideal for internal equipment wiring where space is limited. The subminiature footprint makes it perfect for PCB-to-cable or module-to-module signal paths. Manufactured with high-grade gold-plated brass and a PTFE insulator, it maintains a consistent 50-Ohm impedance up to 4 GHz. Its design is particularly effective in high-vibration environments, where the solder joint provides a more resilient mechanical and electrical connection compared to standard mechanical crimping.
Key Technical Advantages
-
Low-Resistance Solder Bond: The solder-style center contact provides a superior electrical path, minimizing signal attenuation and intermodulation compared to mechanical crimping.
-
Optimized for Micro-Cables: Precision-machined to match the exact dielectric and conductor dimensions of LMR-100, RG-174, and RG-316 (approx. 2.5mm–2.8mm OD).
-
Broadband Performance: Offers stable electrical characteristics and low VSWR from DC up to 4 GHz, making it suitable for a wide range of wireless and test applications.
-
Snap-On Convenience: The click-to-lock coupling allows for rapid mating and unmating in tight chassis spaces where torque wrenches for SMA connectors cannot fit.
-
Premium Gold Plating: The gold-over-nickel finish ensures long-term protection against oxidation and maintains a high-quality surface for easy soldering.
Key Features
-
Interface Type: SMB Female (Jack) with snap-on coupling for fast integration.
-
Termination Style: Solder center contact with a high-strength crimp or solder outer ferrule.
-
Subminiature Footprint: Lightweight and compact design for high-density electronic assemblies and small cell hardware.
-
Teflon (PTFE) Insulator: High-grade insulation that withstands soldering temperatures without melting or deforming.
-
Universal 50-Ohm Impedance: Matches standard RF equipment and test instrumentation for seamless signal routing.
Technical Summary
| Parameter | Specification |
| Impedance | 50 Ohm |
| Frequency Range | DC – 4 GHz |
| Body Material | Brass (Gold Plated) |
| Contact Material | Beryllium Copper (Gold Plated) |
| Insulator | PTFE (Teflon) |
| Mating Cycles | 500+ Cycles |
| Operating Temp | -65°C ~ +165°C |
Reviews
There are no reviews yet.