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UFL F PCB MOUNT

63.00

UFL F PCB MOUNT

63.00

Ultra-miniature U.FL Female PCB Mount Connector precision-engineered for 50-Ohm high-frequency wireless applications. Featuring an extremely low profile (mated height as low as 1.9mm) and a surface-mount (SMT) design, this jack is the global standard for Wi-Fi, Bluetooth, GPS, and 5G modules in smartphones, laptops, and IoT devices.

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Description

Description

The U.FL series (compatible with I-PEX MHF and AMC interfaces) is one of the smallest RF connector series in the world, designed to meet the rigorous space constraints of modern portable electronics. This female (jack/receptacle) variant is designed for Surface Mount Technology (SMT), allowing it to be soldered directly onto the PCB via automated pick-and-place machinery. Its ultra-compact footprint and minimal vertical profile make it indispensable for engineers designing high-density circuit boards where every millimeter of space is critical.

Despite its subminiature size, the U.FL receptacle maintains a consistent 50-Ohm impedance and delivers exceptional performance up to 6 GHz. The connector features a snap-on coupling mechanism that provides a tactile “click” when mated, ensuring a secure electrical connection. Manufactured with gold-plated contacts and a high-temperature liquid crystal polymer (LCP) dielectric, it is built to withstand the high temperatures of lead-free reflow soldering while maintaining superior signal integrity for sensitive microwave frequencies.


Key Technical Advantages

  • Ultra-Low Profile: Offers a mated height of 1.9mm to 2.5mm (depending on the mated plug), making it ideal for the thinnest smartphones, wearables, and tablet devices.

  • Exceptional Space Efficiency: Occupies a tiny PCB footprint (approx. 3mm x 3mm), allowing for maximum component density in compact wireless modules.

  • Broadband Microwave Performance: Optimized for 50-Ohm systems from DC to 6 GHz, covering all major Wi-Fi 6E, Bluetooth, and sub-6 GHz 5G frequency bands.

  • Automated Assembly Ready: Supplied in tape-and-reel packaging for high-speed automated SMT placement, reducing manufacturing costs and increasing consistency.

  • High-Reliability Contact: Gold plating ensures low contact resistance and stable performance even in high-vibration environments like automotive or industrial IoT.


Key Features

  • Interface Type: U.FL (Receptacle) compatible with I-PEX MHF I and AMC.

  • Mounting Type: Surface Mount (SMT) / PCB Mount.

  • Coupling Mechanism: Snap-on for rapid, secure mating.

  • Impedance: 50 Ohm.

  • Frequency Range: DC to 6 GHz.

  • Common Application: Internal antenna connections for Wi-Fi cards, GPS modules, and mobile handsets.


Technical Summary

Parameter Specification
Impedance 50 Ohm
Frequency Range DC – 6 GHz
Body Material Phosphor Bronze (Silver or Gold Plated)
Contact Material Brass / Phosphor Bronze (Gold Plated)
Insulator LCP (Liquid Crystal Polymer)
Mated Height 1.9mm – 2.5mm
Operating Temp -40°C ~ +90°C
Additional information

Additional information

Frequency Range

DC-4 GHz

Impedance

50Ω

Dielectric withsanding V

2.0 kV rms

Insulation resistance

= 5000 MO

Contact resistance

Inner Contact: =2 mO; Outer Contact: =1.5 mO

RF leakage

-60 dB minimum

Durability (matings)

500 mating

Body and Outer Contacts

Brass, gold & silver plated

Compliance

ROHS

Operating Temperature(?)

-25 to +75

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