SAA or 1.0/2.3 F PCB SOLDER

Description

The SAA series, also known as the 1.0/2.3 connector, is a high-performance RF interface specifically designed to address the space constraints of modern telecommunications hardware. This female (jack) PCB mount variant allows for a direct, vertical transition from a printed circuit board to an external 1.0/2.3 cable assembly. The vertical mounting configuration is essential for high-density hardware, where maximizing the number of ports per square inch is critical for modular exchange equipment and routing switchers.

Optimized for a strict 75-Ohm impedance, this connector is vital for maintaining signal transparency in E1, E3, and DS3 digital telephony circuits, as well as 3G-SDI video applications. The through-hole (THT) solder pins provide exceptional mechanical stability and grounding, ensuring the connector can withstand the axial forces of frequent mating cycles. Manufactured with a gold-plated brass body and premium PTFE (Teflon) insulation, it delivers superior electrical stability and high shielding effectiveness, protecting sensitive digital data streams from interference and signal reflection.

Key Technical Advantages

• Ultra-High Density Port Scaling: The subminiature footprint of the 1.0/2.3 interface allows for significantly more connections on a single PCB compared to traditional BNC or SMZ connectors.

• 75-Ohm System Precision: Specifically engineered to match telecommunications impedance standards, preventing bit errors and signal reflections in high-capacity digital circuits.

• Stable Through-Hole Mounting: The multi-pin solder design provides a robust mechanical bond to the PCB, protecting the electrical signal path from physical stress and vibration.

• Superior Thermal Stability: Equipped with a high-grade PTFE dielectric that preserves its internal geometry and electrical properties during industrial wave or hand soldering processes.

• Superior Corrosion Protection: Premium gold-over-nickel plating ensures low contact resistance and long-term durability in professional networking and exchange environments.

Key Features

• Interface Type: SAA / 1.0/2.3 Female (Jack) with 75-Ohm impedance.

• Mounting Style: Vertical PCB Mount (Through-Hole Solder).

• Connection Mechanism: Push-pull / Snap-on for rapid, tool-free mating.

• Premium Construction: Features a gold-plated brass body and beryllium copper contact for maximum conductivity.

• Industrial Application: Ideal for Digital Distribution Frames (DDF), telephony racks, and modular broadcast exchange equipment.

Technical Summary